Strategic objectives
The AMRF Semiconductor Advanced Packaging Facility will serve as Australia’s first commercial advanced packaging facility, acting as a focal point for collaboration, skills development, and investment. Its capabilities are designed with flexibility to achieve three overarching goals:
- Support local industry and research organisations to develop new packaging solutions ready for commercial scale manufacture, with the ability to also provide low-volume production runs for high-value devices where required.
- Leverage international partnerships to connect the NSW and Australian semiconductor ecosystem with global supply chains and attract international players to NSW.
- Address sovereign needs in semiconductors to strengthen Australia’s strategic technology resilience.
Capability overview
The AMRF Semiconductor Advanced Packaging Facility capabilities are still in development, but it is aiming to focus on semiconductor advanced packaging capabilities in flip-chip, fan-out wafer-level packaging and 2.5D architectures. The technology roadmap will see the AMRF develop a foundation of flip-chip capability and progressively integrate more complex processes and technologies over time.
The AMRF has identified six key technology processes that are currently the basis of the AMRF’s capability plans, providing both flexibility and scalability to ensure the Semiconductor Advanced Packaging Facility remains relevant as technologies develop:
- Aluminium pad formation
- Under-bump metallisation (UBM) / solder ball mount
- Under-bump metallisation (UBM) / micro bumps
- Wafer-to-wafer direct bonding
- Chip-to-wafer bonding
- Cu Damascene interconnect.
Application of these, or similar advanced packaging technologies, is considered critical to the AMRF fulfilling its mission of supporting local industry and research applications, to foster the growth of the Australian semiconductor ecosystem, and to grow the pipeline of skilled workers in this sector.